LED production and assembly
Overview
Applications and machines
Dispensing, pick&place, soldering and curing systemes for the manufacturing and the assembly of Light-Emitting Diodes (LED).[ More information ] [ Add to clipboard ]
Technologies
Dispensing Processes for LED
Dispens technologies from Essemtec are used for sealing and encapsulation of LEDs, for lens creation or for adhesive metering.[ More information ] [ Add to clipboard ]
Placement technologies for LED
Mit den Bestückungstechnologien von Essemtec lassen sich LEDs jeder Form exakt montieren: Als unverpackter Chip, als SMD-Komponente, als konventionelles Bauteil und auch als komplettes LED-Modul.[ More information ] [ Add to clipboard ]
Soldering and curing processes for LED
Soldering and curing technologies from Essemtec are available as batch or in-line systems. Hot air convection, UV or IR machines are configured according to the application.[ More information ] [ Add to clipboard ]
Application examples
LED phosphor encapsulation
Dispensing of the phosphor encapsulation for high power LEDs requires a highly accurate volume control. The CDS6200 dispensing machine is designed for such applications and can be equipped with a suitable precision dispensing valve.[ More information ] [ Add to clipboard ]
LED lens dispensing
The lens of an LED can be created directly on board level using a dispensing process. This requires best volume and position control achievable with a CDS6200 dispensing machine.[ More information ] [ Add to clipboard ]
swiss made